ASTM F1839 Die Oxidation Rate Testing
The ASTM F1839 Die Oxidation Rate Testing is a critical procedure used in the semiconductor and microchip manufacturing industries to evaluate the rate at which exposed silicon surfaces oxidize over time. This test method helps ensure that die are manufactured with high reliability, longevity, and performance. The ASTM F1839 standard provides specific guidelines for measuring the oxidation of the exposed silicon surface on a chip after die dicing.
This testing is essential because it directly impacts the electrical properties of the die and its overall functionality in electronic devices. Oxidation can lead to increased resistance, decreased conductivity, and potential failure if not controlled during manufacturing. By performing this test early in the production process, manufacturers can identify any issues with the oxidation process, allowing for corrective actions before mass production.
The ASTM F1839 standard specifies that the test is conducted at a controlled temperature of 25°C ± 0.2°C and under dry air conditions (relative humidity less than 40%). The specimen preparation involves placing the die on a carrier grid in a vacuum chamber, where it is exposed to oxygen gas for a predetermined period. After exposure, the sample is removed from the chamber, cleaned, and weighed to determine the mass change due to oxidation.
The test results are reported as the weight gain or loss of the silicon surface per unit area over time. This provides valuable information on how effectively the oxidation process is being controlled during manufacturing. The standard also includes acceptance criteria that specify acceptable ranges for the oxidation rate, ensuring that only die within specified limits proceed to further stages of production.
Understanding the oxidation behavior of the silicon surfaces at an early stage in the manufacturing process allows manufacturers to optimize their processes and improve product quality. This testing is particularly important for high-performance semiconductor devices where even minor changes in surface properties can significantly affect device performance.
Applied Standards
The ASTM F1839 Die Oxidation Rate Testing is based on the American Society for Testing and Materials (ASTM) standard E1839. This standard provides a detailed procedure for measuring the oxidation rate of silicon surfaces exposed to oxygen in controlled environmental conditions. The ASTM F1839 standard ensures that all tests conducted follow consistent procedures, which is crucial for accurate and reproducible results.
The key aspects of this standard include:
- Controlled temperature: 25°C ± 0.2°C
- Dry air conditions (relative humidity
- Vacuum chamber with a carrier grid for holding the die samples
- Oxygen exposure time of 168 hours ± 3 hours
- Sample preparation and cleaning methods
- Weighing techniques to measure mass change due to oxidation
The standard also includes acceptance criteria that specify acceptable ranges for the oxidation rate. These limits are based on empirical data and are designed to ensure that only die within specified performance parameters proceed further in the manufacturing process.
Customer Impact and Satisfaction
- Improved Product Quality: By identifying issues with the oxidation process early in production, this test helps maintain high-quality products.
- Cost Savings: Early detection of problems reduces rework costs and potential losses from defective units.
- Enhanced Reliability: Ensuring consistent performance across all manufactured die enhances overall product reliability.
- Compliance with Industry Standards: Adhering to ASTM F1839 ensures compliance with industry best practices, which is essential for maintaining a competitive edge in the market.
The results of this testing are highly valued by customers who demand high-quality semiconductor devices. The consistent and reliable performance of these devices is critical for their end-users, whether they be consumer electronics manufacturers or medical device producers. By ensuring that only die within specified limits proceed to further stages of production, this test contributes significantly to the overall quality and reliability of the final products.
Use Cases and Application Examples
| Use Case | Description |
|---|---|
| Dice Post-Dicing Testing: | This test is performed on diced silicon wafers to evaluate the oxidation behavior of the exposed surfaces. It helps determine if the dicing process has inadvertently caused any contamination or damage that could affect the die's performance. |
| Wafer-Level Oxidation Control: | In this scenario, the test is used to monitor the oxidation rate during wafer-level processing. It helps in optimizing the oxidation process and ensuring consistent quality across all wafers. |
| Die Assembly Process Monitoring: | The results of this test are used to validate that the die assembly processes do not introduce any additional contamination or damage. This ensures that the final product meets the required specifications. |
| Quality Control: | This test is a vital part of the quality control process in semiconductor manufacturing. It helps identify any deviations from expected performance early, allowing for corrective actions to be taken promptly. |
The ASTM F1839 Die Oxidation Rate Testing plays a crucial role in various stages of semiconductor and microchip production. From post-dicing evaluation to wafer-level processing and die assembly process monitoring, this test ensures that only high-quality products reach the end-users.
