JEDEC JESD22-B139 Interconnect Electromigration Testing
The JEDEC JESD22-B139 standard is an essential tool in the semiconductor and microchip testing sector, specifically targeting the evaluation of interconnect electromigration effects. This test ensures that electronic devices meet high reliability standards by simulating real-world conditions where electrical current passes through conductors.
Electromigration can lead to significant degradation or failure in critical components such as solder joints and traces on printed circuit boards (PCBs). Understanding the potential risks associated with electromigration is crucial for ensuring product longevity and performance. By adhering to JESD22-B139, manufacturers can validate their designs against these challenges, thereby improving overall quality assurance.
Our laboratory uses state-of-the-art equipment and rigorous protocols to conduct this test accurately. The process involves subjecting the specimen to controlled electrical currents under specified conditions for a defined duration. This allows us to observe any changes in the interconnects that could indicate electromigration issues.
The importance of this testing cannot be overstated, particularly given today’s increasing demand for smaller and more efficient electronic devices. Failure rates can vary widely depending on factors like temperature, current density, and material composition. Our team has extensive experience handling various types of specimens ranging from simple PCBs to complex multi-layer modules.
In addition to providing comprehensive test results, our services include detailed reports outlining the performance characteristics of each specimen tested. These reports serve as valuable resources for quality managers and R&D engineers alike, helping them make informed decisions regarding design improvements or process refinements.
Why It Matters
The reliability of electrical connections is paramount in modern electronics. Failures due to electromigration can result in costly downtime, reduced product lifecycles, and increased warranty costs for manufacturers. By incorporating JESD22-B139 into their quality control processes, companies can proactively address these risks early on.
- Ensure long-term stability of electronic devices
- Reduce risk of product failure in field applications
- Earn customer trust through consistent performance standards
- Achieve regulatory compliance with industry best practices
Scope and Methodology
| Parameter | Description |
|---|---|
| Test Specimens | PCBs, multi-layer modules, and similar interconnect systems. |
| Environmental Conditions | Temperature ranges from -40°C to 150°C (optional). |
| Electrical Current Density | Defined by the JESD22-B139 standard, typically between 60 mA/cm² and 180 mA/cm². |
| Test Duration | Varies based on application requirements but often spans several days to weeks. |
Why Choose This Test
- Comprehensive evaluation of interconnect reliability
- Industry-recognized standard ensuring consistent results
- Predictive insights into potential failure modes
- Supports continuous improvement in design and manufacturing processes
