JEDAEC JESD22-B137 Solder Heat Resistance Testing of Packages
The JEDEC JESD22-B137 standard specifies a method to evaluate the heat resistance performance of packages, particularly focusing on how well they can withstand solder reflow temperatures used in semiconductor assembly and packaging processes. This test is critical for ensuring that electronic components can survive the rigorous conditions encountered during manufacturing without compromising their integrity or reliability.
The JESD22-B137 procedure involves subjecting a sample to controlled thermal cycles under specified conditions, including temperature ramp rates and dwell times at different temperatures. The primary objective is to assess the package's ability to maintain mechanical strength and electrical continuity after exposure to high-temperature environments. Compliance with this standard ensures that semiconductor packages are robust enough for use in various applications where thermal stress might occur.
For effective testing, samples need to be prepared according to the requirements outlined in the JEDEC specification. This typically involves cleaning the sample surface to remove any contaminants or residues that could affect test results. Proper mounting and orientation of the sample within the test setup are also crucial for accurate measurement outcomes.
The equipment used for performing JESD22-B137 testing includes specialized ovens capable of precise temperature control, which can heat samples rapidly while maintaining uniformity throughout the chamber. Data acquisition systems are employed to monitor temperature changes and record results accurately. These systems often feature software that allows operators to set parameters such as ramp rates, dwell times, and hold periods.
The test procedure begins by placing the sample into the oven at room temperature. The oven then heats up according to predefined profiles specified in the standard. During heating, it is essential to ensure consistent heating across all parts of the specimen to avoid localized overheating that might skew results. Once the target temperature has been reached, the specimen remains there for a defined period before being cooled down gradually back to room temperature.
After completing each cycle, inspectors examine the sample visually and use non-destructive testing methods like X-ray imaging or ultrasonic inspection to check for any signs of damage such as cracks or delaminations. If no visible defects are found after multiple cycles, it indicates that the package meets the required level of heat resistance specified by the JEDEC standard.
Compliance with JESD22-B137 is important because it helps manufacturers ensure their products meet industry standards for reliability and durability under harsh environmental conditions. Non-compliance could lead to premature failures in end-user applications, resulting in increased warranty costs and potential reputational damage.
Eurolab Advantages
- State-of-the-art facilities: Our laboratory boasts cutting-edge infrastructure designed specifically for semiconductor testing, ensuring accurate and reliable results.
- Experienced professionals: Our team comprises highly skilled engineers who possess deep expertise in various aspects of semiconductor technology.
- Comprehensive services: We offer a wide range of testing options beyond JESD22-B137, covering multiple phases of product development and manufacturing.
- Prompt turnaround times: Leveraging advanced equipment and efficient workflows allows us to deliver quick reports while maintaining high quality.
Why Choose This Test
- To ensure that semiconductor packages can withstand the stresses of solder reflow processes during manufacturing.
- To enhance product reliability by identifying potential weaknesses before they become issues in end-user applications.
- To comply with industry standards and specifications, thereby supporting global market access requirements.
Heat resistance testing is indispensable for any company involved in designing or producing semiconductor devices. By incorporating this test into their quality assurance processes early on, businesses can significantly reduce the risk of costly rework and recalls later down the line.
Use Cases and Application Examples
| Application Example | Description |
|---|---|
| Data Centers | Ensuring that server motherboards can handle the thermal loads generated by modern processors. |
| Automotive Electronics | Testing automotive-grade semiconductors to guarantee they remain operational even in extreme temperature conditions. |
| Military & Aerospace | Evaluating components used in defense electronics for their ability to operate reliably under severe environmental stress. |
| Consumer Electronics | Verifying the durability of consumer goods like smartphones and tablets against high-temperature exposure during production. |
- Data Centers: High-performance computing requires robust hardware capable of handling substantial heat loads generated by dense packing of components.
- Automotive Electronics: Vehicles operate in diverse climates, demanding that electronic systems function correctly across wide temperature ranges.
- Military & Aerospace: Equipment must meet stringent reliability standards to ensure functionality in hostile environments.
- Consumer Electronics: Products need to maintain optimal performance throughout their lifecycle, including during manufacturing processes.
